LTCC Low Temperature Co-fired Ceramic, Thick film printing,  Ceramic substrates and LTCC ceramic parts.

 Minicaps    LTCC- Low Temperature Cofired Ceramic,      Made in the USA

 
LTCC
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LTCC  Low Temperature Co-fired Ceramic
LTCC Design Rules
Cooling tunnels for heat managements
Low Temperature Co-fired Ceramic LTCC in 3D 
Machining ceramic parts, LTCC material
Capacitors
SLCC Single Layer Ceramic Chip Capacitors
MLCC  Multi Layer Ceramic Chip Capacitors
HVCC High Voltage Ceramic Capacitors,
Resistors
CCR Ceramic chip Resistor:
 
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Low Temperature Co-fired Ceramic (LTCC) Minicaps offers prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramics substrates, LTCC Ceramic Chip Capacitors, LTCC Multilayer ceramic chip capacitors (MLCC) Single layer ceramic chip capacitors (SLCC). Low Temperature Cofired Ceramic (LTCC) Chip Resistors. Multi layer substrate & packaging technology for a wide range of applications. The Low Temperature Co-fired Ceramic (LTCC) materials systems offer the highest performance packaging solutions for high-frequency devices in a wide variety of wireless, telecommunication, microwave, automotive, professional electronics, LTCC Bluetooth, Antenna Module, Transmitter, Power Amplifier, Filter Component, Duplexer Switch, and other applications.

Minicaps introducing a new ceramic substrates with Mini cooling tunnels

                        

  LTCC ceramic substrate with Mini cooling tunnels for heat managements

Minicaps offers new ceramic substrates with Mini cooling tunnels. This is advance ceramic substrate with combinations of LTCC (Low Temperature Co-fired Ceramic) or Thick film printing and ceramic substrates, produces high tech temperature controlled package. The advantage of the Mini cooling tunnels is dissipate heat from ceramic substrate next to critical components (with or with out air enforcing by Mini-fan)

                                                

                                       LTCC - Mini Cooling Tunnel  (X60)  

      The above tunnel is before applying conductive coating of silver.  The above substrate thickness is 0.040".

Minicaps offers prototyping and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramic substrates

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Minicaps offers prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramics substrates, LTCC Ceramic Chip Capacitors, LTCC Multilayer ceramic chip capacitors (MLCC),  Single layer ceramic chip capacitors (SLCC), Low Temperature Cofired Ceramic (LTCC) Chip Resistors.

For LTCC, Thick film printing, chip Capacitors, chip Resistors, or info, please contact Minicaps

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