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LTCC
LTCC Low Temperature Co-fired Ceramic
Cooling tunnels for heat managements
LTCC- ceramic chip package (The Box)
Minicaps offers a variety of ceramic products. LTCC Low Temperature Co-fired Ceramic, Thick film printing and ceramic substrates.
LTCC ceramic substrate with Mini cooling tunnels for heat managements
Minicaps offers new ceramic substrates with Mini cooling tunnels. This is advance ceramic substrate with combinations of LTCC (Low Temperature Co-fired Ceramic) or Thick film printing and ceramic substrates, produces high tech temperature controlled package. The advantage of the Mini cooling tunnels is dissipate heat from ceramic substrate next to critical components (with or with out air enforcing by Mini-fan)
LTCC - Mini Cooling Tunnel (X60)
The above tunnel is before applying conductive coating of silver. The above substrate thickness is 0.040".
Minicaps offers prototyping and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramic substrates,
Contact Minicaps
E mail sales@minicaps.com for LTCC ltcc@minicaps.com
for Engineering: eng@minicaps.com or for any other info info@minicaps.com
California USA, Tel- (949)
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