LTCC Low Temperature Co-fired Ceramic in 3D

Low Temperature Co-fired Ceramic (LTCC) Minicaps offers prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramics substrates, LTCC Ceramic Chip Capacitors, LTCC Multi-layer ceramic chip capacitors (MLCC), Single layer ceramic chip capacitors (SLCC), Low Temperature Co-fired Ceramic (LTCC) Chip Resistors, Multilayer substrate & packaging technology for a wide range of applications. The Low Temperature Co-fired Ceramic (LTCC) materials systems offer the highest performance packaging solutions for high-frequency devices in a wide variety of applications: wireless, telecommunication, microwave, automotive, professional electronics, LTCC Bluetooth, Antenna Module, Transmitter, Power Amplifier, Filter Component, and other applications.

LTCC Low Temperature Co-fired Ceramic (3 layers)

LTCC Low Temperature Co-fired Ceramic (3 layers) BGA (Ball grid array)

LTCC (Low Temperature Co-fired Ceramic) : Cost efficiency for high volumes, High packaging density, Reliability, Integrated and embedded passives component (Capacitors Inductors and Resistors) in the LTCC, good dielectric thickness control, high print resolution of conductors, low K dielectric material. The LTCC (Low Temperature Co-fired Ceramic) is a small PCB (printed circuit board), made from multi layer ceramic dielectric tape and screen printing of conductors materials (Silver or Gold).

Minicaps offers prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramics substrates, LTCC Ceramic Chip Capacitors, LTCC Multilayer ceramic chip capacitors (MLCC), Single layer ceramic chip capacitors (SLCC), Low Temperature Cofired Ceramic (LTCC) Chip Resistors. For LTCC, Thick film printing, chip Capacitors, chip Resistors, or info, please contact Minicaps

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