Minicaps Manufacturer of high Tech ceramic products
LTCC
LTCC Low Temperature Co-fired Ceramic
Minicaps offers a variety of ceramic products, Low Temperature Co-fired Ceramic (LTCC), Thick film printing and ceramic substrates. For more information please contact Minicaps.
LTCC Low Temperature Co-fired Ceramic (3 layers)
LTCC Low Temperature Co-fired Ceramic (3 layers)
LTCC Low Temperature Co-fired Ceramic (3 layers) BGA (Ball grid array)
Low Temperature Co-fired Ceramic (LTCC) Minicaps offers prototyping services of LTCC (Low Temperature Co-fired Ceramic) multilayer substrate & packaging technology for a wide range of applications. The Low Temperature Co-fired Ceramic (LTCC) materials systems offer the highest-performance packaging solutions for high-frequency devices in a wide variety of wireless, telecommunication, microwave, automotive, professional electronics, LTCC Bluetooth, Antenna Module, Transmitter, Power Amplifier, Filter Component, Duplexer Switch, and other applications. The advantages of the LTCC (Low Temperature Co-fired Ceramic) : Cost efficiency for high volumes, High packaging density, Reliability, Integrated and embedded passives component (Capacitors Inductors and Resistors) in the LTCC, good dielectric thickness control, high print resolution of conductors, low K dielectric material. The LTCC (Low Temperature Co-fired Ceramic) is a small PCB (printed circuit board), made from multilayer ceramic dielectric tape and screen printing of conductors materials (Silver or Gold) on the green ceramic tape.
LTCC- Low Temperature Co-fired Ceramic process and parameters
Typical Process and material properties of LTCC Low Temperature Co-fired Ceramic
LTCC Green and fired Ceramic tape thickness.
| Green tape Thickness | Fired thickness |
| 51µm (2 mils) | 1.7 mils |
| 114µm (4.5 mils) | 3.8 mils |
| 165µm (6.5 mils) | 5.5 mils |
| 254µm (10 mils) | 8.5 mils |
LTCC fired Dielectric Constant @1 MHz 7.8
DF (Dissipation Factor) @ 10 MHz 0.15%
I R (Insulation Resistance) @ 100 V DC > 1012 Meg ohms
Breakdown Voltage V/25µm > 1000V
LTCC Shrinkage X, Y 12.2%, Z 15%
Thermal expansion (25°C-300°C) 5.8ppm/°C
Typical LTCC Via Diameter is 101µm (4 mils) Via cap 8 mils
4 mils via
(X200)
Line Width 6 mils, Line space 6 mils
Cofired Inner Layer Conductor 100% Silver (Ag).
Cofired Top Layer Conductor Pd/Ag Solderable termination, or Gold.
Up to 20 layers.
Go to : LTCC Design Rules
For Engineering assistance in LTCC, or information, Please contact minicaps
Contact Minicaps
E mail sales@minicaps.com Home http://www.minicaps.com
California USA, Tel- (949) Fax-
All rights reserved