LTCC Low Temperature Co-fired Ceramic, Thick film printing,  Ceramics substrates and LTCC ceramics parts.

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LTCC

LTCC  Low Temperature Co-fired Ceramic

LTCC Design Rules

Low Temperature Co-fired Ceramic LTCC in 3D 

Machining ceramics parts LTCC material

Cooling tunnels for heat managements

Capacitors

SLCC Single Layer Ceramic Chip Capacitors

MLCC  Multi Layer Ceramic Chip Capacitors

HVCC High Voltage Ceramic Capacitors

 

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LTCC - Low Temperature Co-fired Ceramic, Minicaps offers prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing and ceramic substrates.

Typical LTCC design rules for LTCC

Design rules 

Standard (in)

Option 

Via diameter

0.006

0.004" to 0.008"

Via cover Pad

0.009

+0.004" Via Diameter

Via pad to via pad

0.008

 

Line width

0.006

0.003" and up

Line to line spacing

0.006

0.003"

Via pad to LTCC edge

0.014

 

Line to LTCC edge

0.012

 

Planes grid Line

0.006

 

Planes line spacing

0.012

0.010"

Planes to LTCC edge

contact LTCC LAB

 

 

 

 

 

 

 

LTCC Green and fired tape thickness.

Green tape Thickness Fired thickness
51m (2 mils) 1.7 mils
114m (4.5 mils) 3.8 mils
165m (6.5 mils) 5.5 mils
254m (10 mils)  8.5 mils

LTCC- Low Temperature Co-fired Ceramic parameters

LTCC Dielectric constant @1 MHz 7.8

DF (Dissipation Factor) @ 10 MHz 0.15%

I R (Insulation Resistance) @ 100 V DC > 1012  Meg ohms 

Ceramic breakdown Voltage V/25m  > 1000V

LTCC Shrinkage  X, Y 12.2%,  Z 15%

Thermal expansion of LTCC (25C-300C) 5.8ppm/C

Typical LTCC via diameter is 0.006" via cap 0.009"

Line width 0.006", line space 0.006"

Cofired inner layer conductor 100% Silver (Ag).

Cofired top layer conductor Pd/Ag, Solderable termination, or Gold.


Typical Design Rules for LTCC.


               

              LTCC green tape with 4 mils via (X200) (Recommended 6 mils via)


LTCC R1 - 0.006" line and 0.006" space between the lines.

 


 LTCC R2 - 0.008" Space -Via cap to line and via cap to via cap (Recommended 0.006" via)

 


LTCC R3 - 0.006" Via to 0.006" line connection (Recommended 0.006" via)


LTCC R4 - 0.008" via cap to via cap (Recommended 0.006" via)


LTCC R5 - Planes, 0.006" grid line and 0.012" space between the line


LTCC R6 - 0.012" space between line to LTCC edge and 0.014" via pad to LTCC edge  (Recommended 0.006" via)

go to : LTCC Design Rules, For Engineering assistance in LTCC and information, Please contact Minicaps 

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LTCC (Low Temperature Co-fired Ceramic) : Cost efficiency for high volumes, High packaging density, Reliability, Integrated and embedded passives component (Capacitors Inductors and Resistors) in the LTCC, good dielectric thickness control, high print resolution of conductors, low K dielectric material. The LTCC (Low Temperature Co-fired Ceramic) is a small PCB (printed circuit board), made from multilayer ceramic dielectric tape and screen printing of conductors materials (Silver or Gold).

Minicaps offers prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramics substrates, LTCC Ceramic Chip Capacitors, LTCC Multilayer ceramic chip capacitors (MLCC),  Single layer ceramic chip capacitors (SLCC), Low Temperature Cofired Ceramic (LTCC) Chip Resistors. For LTCC, Thick film printing, chip Capacitors, chip Resistors, or info, please contact Minicaps

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