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LTCC
LTCC Low Temperature Co-fired Ceramic
Cooling tunnels for heat managements
LTCC- ceramic chip package (The Box)
Typical Design Rules for LTCC.
LTCC green tape with 4 mils via (X200)
LTCC R1 - 6 mils Line and 6 mils space between the Lines.
LTCC R2 - 12 mils Space Via to Line
LTCC R3 - Via to Line connection
LTCC R4 - 12 mils Via pitch to Via pitch (4 mils vias)
LTCC R5 - Planes, 6 mils Grid Line and
10 mils Space between the Line
LTCC R6 - 12 mils (0.012") Space Line to ceramic Edge,
14 mils (0.014") Via pitch to ceramic Edge
LTCC- Low Temperature Co-fired Ceramic process and parameters
LTCC Green and fired tape thickness.
| Green tape Thickness | Fired thickness |
| 51µm (2 mils) | 1.7 mils |
| 114µm (4.5 mils) | 3.8 mils |
| 165µm (6.5 mils) | 5.5 mils |
| 254µm (10 mils) | 8.5 mils |
LTCC fired Dielectric Constant @1 MHz 7.8
DF (Dissipation Factor) @ 10 MHz 0.15%
I R (Insulation Resistance) @ 100 V DC > 1012 Meg ohms
Ceramic Breakdown Voltage V/25µm > 1000V
LTCC Shrinkage X, Y 12.2%, Z 15%
Thermal expansion of LTCC (25°C-300°C) 5.8ppm/°C
Typical LTCC Via Diameter is 101µm (4 mils) Via cap 9 mils
Line Width 6 mils, Line space 6 mils
Cofired Inner Layer Conductor 100% Silver (Ag).
Cofired Top Layer Conductor Pd/Ag, Solderable termination, or Gold.
The above Design rules are typical. We can change the Design rules to meet customer specifications.
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