Minicaps Manufacturer high Tech LTCC ceramic products
LTCC
LTCC Low Temperature Co-fired Ceramic
Cooling tunnels for heat managements
Machining ceramic parts, LTCC material
Low Temperature Co-fired Ceramic LTCC in 3D
Capacitors
LTCC, SLCC Single Layer Ceramic Chip Capacitors
LTCC, MLCC Multi Layer Ceramic Chip Capacitors
HVCC High Voltage Ceramic Capacitors, LTCC
Resistors
Low Temperature Co-fired Ceramic (LTCC) Minicaps offers prototyping services of LTCC (Low Temperature Co-fired Ceramic) multilayer substrate & packaging technology for a wide range of applications. The Low Temperature Co-fired Ceramic (LTCC) materials systems offer the highest performance packaging solutions for high-frequency devices in a wide variety of wireless, telecommunication, microwave, automotive, professional electronics, LTCC Bluetooth, Antenna Module, Transmitter, Power Amplifier, Filter Component, Duplexer Switch, and other applications.
LTCC Low Temperature Co-fired Ceramic
Low
Temperature Co-fired Ceramic LTCC
in 3D
The advantages of LTCC (Low Temperature Co-fired Ceramic) : Cost efficiency for high volumes, High packaging density, Reliability, Integrated and embedded passives component (Capacitors Inductors and Resistors) in the LTCC, good dielectric thickness control, high print resolution of conductors, low K dielectric material. The LTCC (Low Temperature Co-fired Ceramic) is a small PCB (printed circuit board), made from multilayer ceramic dielectric tape and screen printing of conductors materials (Silver or Gold) on the green ceramic tape.
LTCC- Low Temperature Co-fired Ceramic process and parameters
LTCC Green and fired Ceramic tape thickness.
| Green tape Thickness | Fired thickness |
| 51µm (2 mils) | 1.7 mils |
| 114µm (4.5 mils) | 3.8 mils |
| 165µm (6.5 mils) | 5.5 mils |
| 254µm (10 mils) | 8.5 mils |
LTCC fired Dielectric Constant @1 MHz 7.8
DF (Dissipation Factor) @ 10 MHz 0.15%
I R (Insulation Resistance) @ 100 V DC > 1012 Meg ohms
Ceramic Breakdown Voltage V/25µm > 1000V
LTCC Shrinkage X, Y 12.2%, Z 15%
Thermal expansion of LTCC (25°C-300°C) 5.8ppm/°C
Typical LTCC Via Diameter is 101µm (4 mils) Via cap 8 mils
Line Width 6 mils, Line space 6 mils
Cofired Inner Layer Conductor 100% Silver (Ag).
Cofired Top Layer Conductor Pd/Ag, Solderable termination, or Gold.
Up to 20 layers.
go to : LTCC Design Rules
For Engineering assistance in LTCC, or information, Please contact minicaps
Minicaps offers prototyping and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramic substrates, LTCC Ceramic Chip Capacitors, LTCC Multilayer ceramic chip capacitors (MLCC), Single layer ceramic chip capacitors (SLCC), Low Temperature Cofired Ceramic (LTCC) Chip Resistors.
For LTCC, Thick film printing, chip Capacitors, chip Resistors, or info, please contact Minicaps
E mail sales@minicaps.com for LTCC ltcc@minicaps.com
for Engineering: eng@minicaps.com or for any other info info@minicaps.com
California USA, Tel- (949) 305-8126
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