LTCC Low Temperature Co-fired Ceramic, Thick film printing,  Ceramic substrates and LTCC ceramic parts.

 Minicaps    LTCC- Low Temperature Cofired Ceramic,      Made in the USA

 

LTCC
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LTCC  Low Temperature Co-fired Ceramic
LTCC Design Rules
Cooling tunnels for heat managements
Low Temperature Co-fired Ceramic LTCC in 3D 
Machining ceramic parts, LTCC material
Capacitors
SLCC Single Layer Ceramic Chip Capacitors
MLCC  Multi Layer Ceramic Chip Capacitors
HVCC High Voltage Ceramic Capacitors,
Resistors
CCR Ceramic chip Resistor:
 
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Low Temperature Co-fired Ceramic (LTCC) Minicaps offers prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramics substrates, LTCC Ceramic Chip Capacitors, LTCC Multilayer ceramic chip capacitors (MLCC) Single layer ceramic chip capacitors (SLCC). Low Temperature Cofired Ceramic (LTCC) Chip Resistors. Multi layer substrate & packaging technology for a wide range of applications. The Low Temperature Co-fired Ceramic (LTCC) materials systems offer the highest performance packaging solutions for high-frequency devices in a wide variety of wireless, telecommunication, microwave, automotive, professional electronics, LTCC Bluetooth, Antenna Module, Transmitter, Power Amplifier, Filter Component, Duplexer Switch, and other applications.

LTCC Low Temperature Co-fired Ceramic

LTCC Low Temperature Co-fired Ceramic in 3D 

 

The advantages of LTCC (Low Temperature Co-fired Ceramic) : Cost efficiency for high volumes, High packaging density, Reliability, Integrated and embedded passives component (Capacitors Inductors and Resistors) in the LTCC, good dielectric thickness control, high print resolution of conductors, low K dielectric material. The LTCC (Low Temperature Co-fired Ceramic) is a small PCB (printed circuit board), made from multilayer ceramic dielectric tape and screen printing of conductors materials (Silver or Gold) on the green ceramic tape.

LTCC- Low Temperature Co-fired Ceramic process and parameters

LTCC Green and fired Ceramic tape thickness.

Green tape Thickness Fired thickness
51µm (2 mils) 1.7 mils
114µm (4.5 mils) 3.8 mils
165µm (6.5 mils) 5.5 mils
254µm (10 mils)  8.5 mils

LTCC fired Dielectric Constant @1 MHz 7.8

DF (Dissipation Factor) @ 10 MHz 0.15%

I R (Insulation Resistance) @ 100 V DC > 1012  Meg ohms 

Ceramic Breakdown Voltage V/25µm  > 1000V

LTCC Shrinkage  X, Y 12.2%,  Z 15%

Thermal expansion of LTCC (25°C-300°C) 5.8ppm/°C

Typical LTCC Via Diameter is 101µm (4 mils) Via cap 8 mils

Line Width 6 mils, Line space 6 mils

Cofired Inner Layer Conductor 100% Silver (Ag).

Cofired Top Layer Conductor Pd/Ag, Solderable termination, or Gold.

Up to 20 layers.

go to : LTCC Design Rules

For Engineering assistance in LTCC, or information, Please contact Minicaps 

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Minicaps offers prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramics substrates, LTCC Ceramic Chip Capacitors, LTCC Multilayer ceramic chip capacitors (MLCC),  Single layer ceramic chip capacitors (SLCC), Low Temperature Cofired Ceramic (LTCC) Chip Resistors.

For LTCC, Thick film printing, chip Capacitors, chip Resistors, or info, please contact Minicaps


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